LiB

PVD magnetron sputtering coating machine

PVD magnetron sputtering coating machine

Make use of the principle of magnetron sputtering to plate the foil surface with nano-scale coating
In the field of composite current collector, nano-scale copper seed layer can be plated on the surface of PP/PET film.

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Key Features

Transfer the target material to the attachment based on the principle of magnetron sputtering;
Built-in winding mechanism, mainly for foil that can be unwound and rewound;
Thin coating (ranging from several nm to several hundred nm) varies greatly due to different target materials;
Temperature, torque, speed and other parameters are independently controlled at all levels.

Technical Parameters

Item
Parameter
Maximum coated roll diameter

Φ600mm

Composite copper foil coated film resistance

1-2.5 Ω

Coating layer thickness

20-80nm

Film forming speed

8-50m/min

Film forming width

Customized, 800-1700mm